WSB自動(dòng)粘片機(jī)簡(jiǎn)介：
The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide.

The bonding unit is designed to minimise breakage with these expensive materials, whilst retaining the highest quality of sample yield.

WSB自動(dòng)粘片機(jī)特點(diǎn)：

• Automated process cycle

• Excellent wafer to support disc parallelism

• Process Repeatability

• 4" or 6" wafer capacity

• Single or multiple wafer bonding

Logitech WSB單元為硅和砷化鎵等易碎半導(dǎo)體晶片的加工提供優(yōu)質(zhì)的鍵合。粘合單元的設(shè)計(jì)旨在大程度地減少這些昂貴材料的斷裂，同時(shí)保持最高質(zhì)量的樣品產(chǎn)量。

自動(dòng)粘片機(jī)特點(diǎn)：
•自動(dòng)化流程循環(huán)

•出色的晶圓支持光盤(pán)平行度

•過(guò)程重復(fù)性

•4英寸或6英寸晶圓容量

•單晶圓或多晶圓鍵合